UCI-based startup Integra Devices enables the manufacture of integrated, microscopic 3D structures that sense things, move things, and modify radio waves to make possible new Internet of Things and 5G wireless applications.
Integra’s patented manufacturing technique, called Amalga™, makes it possible to manufacture of complex 3D microstructures in laminates such as package substrates and printed circuit boards (PCB). Based on 15 years of research from the University of California Irvine, Amalga™ overcomes the limitations of existing silicon processes, providing multiple industries the ability to miniaturize electromechanical products (like radio frequency/microwave electromechanical relays that can transmit and or receive signals between devices) to an extent not possible before. “This is groundbreaking technology that offers designers another toolbox to considerably increase the performance of their products,” commented Sourabh Dhillon, business development manager for Integra Devices. “We are looking forward to working with our customers to help enable a new breed of solutions.”
Integra Devices’ technology allows the production of microdevices at one-tenth the cost to design, one-third the time to develop, and one-fourth the cost to manufacture compared to conventional methods. For applications such as reconfigurable and phased array antennas that require density and performance, Integra Devices offers both services and custom substrates that enable their customers to embed 8, 12, and even 20 gigahertz (GHz), relays within printed circuit board and signal paths. Integra’s enables creating circuits without complex input and output between the relays and other high-frequency circuit elements, improving overall circuit performance. Other elements can be mounted above the relay on the printed circuit board, optimizing valuable surface.